Non-electrolytic copper plating catalyst copper paste OPC Copaseed SCP
Newly developed copper paste "OPC Copashield SCP" for direct printing of electroless copper plating seed layers onto film.
With the evolution of IoT, various devices and gadgets are now connected to the network in addition to computers and smartphones. In particular, fields such as wearable devices and smart home appliances are expected to expand, and printed electronics, which directly print electrical circuits onto flexible materials, are attracting attention. Okuno Pharmaceutical Industry has developed a copper paste called "OPC Copaseed SCP," which can directly print a seed layer for electroless copper plating onto film, by merging the surface treatment and screen printing technologies cultivated over many years as a technology in harmony with the environment. Currently, the subtractive method using single-sided copper-clad laminates (Flexible Copper Clad Laminates; FCCL) is the mainstream for manufacturing flexible printed circuit boards. Subtractive means subtraction in English, and it forms circuits by etching away unnecessary parts from the copper foil. Our company has developed a screen printing copper paste "OPC Copaseed SCP" and an electroless copper plating solution "OPC Copper HFS" for printed electronics. This process enables the reduction of environmental impact and improvement of productivity.
- Company：奥野製薬工業 大阪・放出、東京、名古屋など
- Price：Other
